Intel, Nanotech Sign 200MM Manufacturing Process And Equipment Agreement
June 21, 2004 |
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Comments | Category: Gadgets & Electronics
Nanotech Corporation and Intel Corporation today announced an agreement whereby Intel will provide manufacturing process technology and equipment for first phase of Nanotech's proposed wafer fabrication facility in Changzhou National Hi-Tech District, Changzhou, Jiangsu Province.
The agreement includes a license and technology transfer of Intel's 0.35 micron and 0.25 micron CMOS process technology. It also includes the transfer of a line of matching 200 mm equipment to run the process and appropriate training for Nanotech's manufacturing staff. Under terms of the agreement Intel will provide equipment to run up to 15 thousand wafer starts per month. The agreement between the companies is subject to government and other regulatory review. Other terms of the agreement are confidential.
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