UCLA CHIPS Commences Partnership with Leading Semiconductor Industry Groups in Taiwan Virtual signing ceremony with representatives from CHIPS, ITRI and AITA The Center for Heterogeneous Integration and Performance Scaling (CHIPS) Engineering signed the Memorandum of Understanding on Cooperation in Heterogeneous Integration Advanced Packaging on Sept. 14 in conjunction with Taiwan’s Industrial Technology Research Institute (ITRI) on Chip Taiwan Alliance (AITA) . The goal of the agreement is to combine the resources and efforts of CHIPS, ITRI and AITA to improve AI chip designs and their global distribution. AI chips can be designed to drive large-scale computing systems with higher speeds...