Apple’s laser-focused efforts are currently to bring CXMT as a supply chain partner for DRAM in an attempt to reduce shortage risk rather than seeking competitive prices, as AI datacenters are estimated to hoard more than 60 percent of memory shipments by next year. While the Cupertino firm attempts to appease the steadfast Trump Administration, a new report discusses a development in which CXMT has begun R&D on a new kind of DRAM that can maximize both performance and capacity, all while using older DUV machinery.

Work on “bonding DRAM” with existing DUV equipment could propel CXMT to new heights, as high-density memory could get Apple highly interested

A new report from Korea Economic Daily mentions the use of W2W or Wafer-to-Wafer Hybrid Bonding that replaces traditional microbumps to connect the DRAM chips, instead relying on two wafers precisely aligned and fused. Also known as bonding DRAM, CXMT is apparently testing this technology at a pilot line in Hefei, China, with the primary goal being the mass production of high-density memory.

Another component that goes towards bonding DRAM production is the separation of the memory cell array and peripheral control logic circuits. With both present on different wafers, these parts can be manufactured using different processes, ensuring an optimized outcome. The two core breakthroughs mentioned above remove traditional microbumps that would otherwise utilize more physical space, increasing latency and parasitic electrical resistance.

High-density DRAM boasts increased transmission speeds that consumes less power by shortening wire lengths, all without increasing the chip’s horizontal footprint for the memory chip. As a result, bonding DRAM will free up valuable space on an iPhone logic board, giving Apple slightly more headroom to add different components to improve the user experience.

With China’s technological acceleration hampered by U.S. sanctions, there’s no chance specialized EUV equipment can reach its shores. Fortunately, CXMT won’t require such ludicrously expensive paraphernalia. What’s more important is that while Samsung and SK hynix control the majority of the world’s DRAM supply, it’s China and its 119 patents that can close the gap in 3-5 years, at least, according to the report.

Apple’s and CXMT’s partnership could be formed at an opportune time

Given how the iPhone maker often calls “dibs” for TSMC’s next-generation wafer shipments, Apple could enable the same practice with CXMT, obtaining possession of high-density DRAM before the competition does, thanks to its advantage of sheer volume. With the California-based titan offering a large enough order, CXMT will have little choice but to comply with potentially its most lucrative customer.

With the final piece of the puzzle being the green light given by the Trump Administration, Apple and CXMT could develop a blossoming partnership. Unfortunately, without getting way ahead of ourselves, it’s important to remember that the Chinese manufacturer has only introduced the R&D phase, meaning that it could take several years before this high-density DRAM enters mass production. There’s also a chance this technology won’t adhere to Apple’s strict quality requirements and will be rejected altogether.

In short, there are a ton of variables we haven’t accounted for, so it would be a great idea to take a step back, take a breather, and wait for an actual partnership to materialize between the two.

News Source: Korea Economic Daily

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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