Facing physical limits in conventional silicon infrastructure, Chinese research institutions and state-owned technology enterprises are accelerating the rollout of third-generation semiconductors and optoelectronic chips designed to power artificial intelligence computing networks and bypass traditional hardware bottlenecks.
The strategic shift was highlighted during the 2026 ZGC Forum Series on Compound Semiconductor Optoelectronic Devices in Beijing, where industry leaders outlined a fundamental transition toward optoelectronic fusion. ZGC Semiconductor Lighting Joint Innovation Key Laboratory Director Wu Ling noted that compound semiconductor optoelectronics are entering a pivotal growth phase driven by simultaneous technical breakthroughs and expanding commercial adoption.
Scientific experts underscored that traditional electrical interconnects can no longer keep pace with exponential AI growth. Tsinghua University Professor and Chinese Academy of Engineering Academician Luo Yi stated that AI represents the largest market opportunity for optoelectronics, as conventional copper wiring hits severe bandwidth and energy consumption ceilings. Luo emphasized that co-packaged optics, in-memory computing, and reconfigurable optical switching are critical to optimizing memory, calculation, and transmission resources across massive computing clusters.
Academic researchers presented significant manufacturing milestones aimed at 12-inch wafer production. Sun Yat-sen University Professor Yu Siyuan revealed that his team achieved on-chip lase emission for indium phosphide lasers on 12-inch silicon photonic wafers with a bonding yield exceeding 90 percent, paired with detectors operating at an 80-gigahertz bandwidth. Concurrently, Peking University Professor Wang Xingjun introduced an integrated optoelectronic oscillator covering the 0.5 to 115 gigahertz spectrum, overcoming the noise accumulation that plagues conventional electrical frequency multipliers.
In parallel, state-owned technology giant China Electronics Technology Group Corporation detailed major industrialization milestones in third-generation silicon carbide semiconductors. Building on the long-standing research legacy of its 13th Research Institute, CETC confirmed it has established a fully domestic supply chain spanning raw materials, chips, integrated micro-systems, and commercial power modules.
CETC development teams highlighted that soaring AI data center expansion has created urgent demand for low-loss power components, driving custom co-development efforts with power and computing companies. Looking ahead through 2030, the conglomerate plans to scale its silicon carbide manufacturing processes across smart grids, electric vehicles, and AI computing hubs to strengthen national technological self-reliance.
