Chinese semiconductor materials suppliers are accelerating expansion plans and making key technological inroads across the global artificial intelligence supply chain as domestic demand for specialized chips and next-generation power electronics continues to surge.
Shenzhen-listed printed circuit board chemical manufacturer Skytech Technology reported robust financial growth for the first half of 2026, projecting revenue between 300 million and 310 million yuan ($42 million to $43.4 million), an increase of up to 45 percent year over year. The company expects net profit to jump as much as 77 percent during the same period to 65 million yuan.
The profit growth follows a strong first quarter in which net profit surged nearly 58 percent, propelled by rising global investment in artificial intelligence computing infrastructure. Industry research projects the global wet-process plating materials market will reach 49.5 billion yuan in 2026, with mainland China accounting for 18.4 billion yuan. Skytech has emerged as the sole domestic supplier of specialized printed circuit board chemicals to enter NVIDIA's supply chain, providing copper plating and pulse electroplating solutions optimized for high-end server boards and advanced substrate packaging.
Beyond circuit board chemistry, Skytech is expanding into advanced semiconductor packaging techniques, including through-glass via and through-silicon via technologies. The company’s specialized electroplating solutions have secured trial orders from major domestic clients, offering a step-fill process that improves production yield by 20 percent while reducing manufacturing costs by 15 percent.
Simultaneously, China's power semiconductor sector is undergoing rapid restructuring as automakers and energy providers accelerate adoption of third-generation materials like silicon carbide. Driving the demand is the widespread adoption of 800-volt high-voltage fast-charging platforms in electric vehicles, where silicon carbide devices can extend driving range by approximately 6 percent compared to traditional silicon-based components while reducing cooling demands and physical footprint.
Domestic supplier TYSiC is positioning itself to capture market share as the global silicon carbide market moves from standard six-inch wafers to cost-effective eight-inch wafers. Transitioning to eight-inch production increases available surface area per wafer, which is expected to reduce overall device manufacturing costs by 30 percent or more.
TYSiC has become one of the first domestic companies capable of mass-producing eight-inch silicon carbide epitaxial wafers, challenging foreign dominance in high-end power electronics. Industry projections estimate that China's silicon carbide power semiconductor market will maintain a compound annual growth rate of 54.8 percent through 2028, supported by surging demand across electric vehicles, solar power generation, smart grids, and high-power artificial intelligence data centers.