Siemens China announced that it has signed an agreement with Huawei for a joint venture in Beijing called TDTech. The new company is to develop, produce and sell 3G-based products.

Zeng Peiyan, vice minister of the State Council attended the signing ceremony in Beijing yesterday.

According to the agreement, the headquarters of TDTech will be in Beijing and involves a total investment of US$100 million.

The firm is expected to provide its first batch of national 3G standard base station products by 2005. Starting this month, the two sides will carry out spot tests of the Chinese 3G standard TD-SCDMA.