AlixLabs AB today announced that the company has been granted a patent in Taiwan relating to Atomic Layer Etch Pitch Splitting (APS) STOCKHOLM, Oct. 12, 2021 /PRNewswire/ — AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the manufacturing process – Atomic Layer Etch Pitch Splitting (APS)*. The method makes the components cheaper and less resource-intensive to manufacture and can open up a new path for a more sustainable mass production of electronics. The method also makes it possible to manufacture tiny semiconductor components accurately...