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T3G Selects Cadence Incisive Platform For China Mobile Phone Chipset

May 20, 2004
Editorial Staff

Cadence Design Systems, Inc. today announced that T3G has selected the Cadence Incisive functional verification platform to verify IC and develop a reference design for China's next-generation TD-SCDMA mobile phone.

T3G chose the Incisive platform because it provides the speed and efficiency to significantly reduce overall verification time, critical for faster time-to-market. The creation of the reference design also accelerates the commercialization of the TD-SCDMA standard and advances the development of China's TD-SCDMA mobile communications industry.

T3G is a joint venture company comprised of Datang Mobile Communications Equipment Co., Ltd., Royal Philips Electronics and Samsung Electronics. T3G specializes in providing handset companies with a complete solution that includes a system reference design, hardware platform, software, TD-SCDMA/GSM/GPRS dual-mode handset chipset design, and customized technical support. T3G verified its TD-SCDMA reference design using the Incisive unified simulator, a comprehensive verification environment that delivers full transaction-level support and unified test generation, as well as Incisive Conformal ASIC, which provides equivalence checking to minimize the risk of silicon respins. The speed and comprehensiveness of the Incisive platform, coupled with Cadence's strong technical support, helped T3G significantly reduce its research and development time.

Related Topics: China | China Mobile | chipset | communications | Datang | Datang Mobile | development | dual-mode | environment | equipment | Gadgets & Electronics | GPRS | GSM | handset | hardware | IT | joint venture | mobile | mobile phone | Philips | phone | platform | research | Samsung | Software

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