Another Heterogeneous Integration Roadmap The UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) and SEMI have announced that they have been awarded a $0.3MM grant from NIST to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US. This is one of the first awards by NIST’s Advanced Manufacturing Technology Roadmap Program, and will fund the project for 18 months. We are told in press releases that “the roadmap will build upon the previously established International Technology Roadmap for Semiconductors (ITRS)” and that SEMI, the global electronics industry association will “…define a process for…