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TSMC tossing silicon wafers in garbage cans near fabs not considered "chip binning"

March 2, 2025
Source: phonearena.com phonearena.com
News Snapshot:
After a chip is manufactured, testing is done to measure its clock speed, power consumption, the number of working cores, and more. After testing, the chips as classified by how they perform. Top-performing components are placed in the top bins and are sold as high-end silicon. Other chips that don't make the grade are placed in lower bins and command reduced prices. A chip with one defective core could be sold as having seven cores instead of eight, for example. This practice is known as "Chip Binning" and while not really part of this practice, a Reddit subscriber happened to...
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China Tech Buzz Topics: AI | China | chip | chips | factory | GPU | IT | manufacturing | mobile | Nanjing | news | picture | power | privacy | subscriber | testing | TSMC | wafer

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